Domain II · High-performance semiconductors

Wide-bandgap semiconductors on substrates that can take the heat.

The most demanding power and defence electronics depend on semiconductors that can take extreme conditions: high power, intense heat, and environments where reliability is non-negotiable. Today's technology is increasingly the bottleneck, capping how hard these systems can be pushed.

The research

Gallium nitride, integrated differently

The project is led by Joan Redwing, distinguished professor of materials science and engineering and of electrical engineering at Penn State. Her team will explore new ways to integrate gallium nitride, a wide-bandgap semiconductor material that is more versatile than conventional silicon, and related wide-bandgap and ultrawide-bandgap semiconductors with substrates that offer improved thermal and electrical performance.

These semiconductors can operate at higher voltages, temperatures and power densities than many traditional materials, making them promising for advanced electronics, communications and sensing. Their performance, however, can be limited by the substrates and interfaces on which the semiconductor layers are grown.

The researchers will investigate whether atomically thin interlayers, materials designed to improve how different materials connect and perform together, can help gallium nitride semiconductors integrate more effectively with materials such as diamond and aluminium nitride, relieve stress where the materials meet and reduce defects during semiconductor growth.

The work will combine materials synthesis and characterisation, with the goal of moving beyond conventional approaches for growing crystalline layers. Battalion's programme targets this bottleneck directly, pursuing a step change in semiconductor performance for the most demanding applications, in an area of strategic national and commercial importance where barriers to entry are high.

Layered stack: gallium nitride on an atomically thin interlayer on a high-thermal-conductivity substrate, with heat flowing down through the stack DOMAIN II · SEMICONDUCTOR INTEGRATION STACK Gallium nitride (GaN) device layerAtomically thin 2D interlayerHigh-thermal-conductivity substrate (e.g. diamond, AlN)HEATDISSIPATEDAIM · FEWER CRYSTALLINE DEFECTS · LOWER INTERFACIAL THERMAL RESISTANCEGROWTH ON SUBSTRATES PREVIOUSLY INCOMPATIBLE WITH DIRECT DEPOSITION
A 2D interlayer between the GaN device layer and a high-thermal-conductivity substrate.
  • LeadDr Joan M. Redwing, Principal Investigator
  • Co-investigatorsJoshua A. Robinson · Adrianus van Duin · Chen Chen
  • InstitutionMaterials Research Institute, Penn State
  • TermThree years from 16 July 2026
  • FundingUp to $1 million per year
  • ApplicationsAdvanced electronics, communications and sensing; radar, electronic warfare, high-power defence and energy systems

“By using atomically thin two-dimensional materials as interlayers, we aim to minimize crystalline defects and interfacial thermal resistance while enabling wide-bandgap semiconductor growth on high-thermal-conductivity substrates that have traditionally been incompatible with direct deposition.”

Joan Redwing · Principal Investigator
Research team

Domain II team

Dr Joan M. RedwingPrincipal Investigator · Distinguished Professor of Materials Science and Engineering and of Electrical Engineering
Dr Joshua A. RobinsonCo-Principal Investigator · Director, Materials Research Institute; Professor of Materials Science and Engineering
Dr Adrianus van DuinCo-Principal Investigator · Distinguished Professor of Mechanical Engineering
Dr Chen ChenCo-Principal Investigator · Assistant Research Professor, Materials Research Institute

Read Dr Redwing's biography

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